According to the current analysis of Reports and Data, the global Phase-Change Thermal Interconnection components market was valued at USD 1.31 Billion in 2019 and is projected to reach USD 6.13 Billion value by the year 2027, at a CAGR of 21.4%. %. Phase Change Thermal Interconnection Material (PCM) is the technology used for producing bulk thermal conductivity, melting enthalpy, specific heat capacity, and contact resistance. Phase Change Thermal Interconnection Material is basically used for the preprocessor of electronic devices such as computers, smartphones, CPUs, etc. More recently, the development of the Phase Change Materials (PCM) of the high-powered Pentium processor class of interconnection materials gained worldwide acceptance. The large quantities of heat created by these processors demanded a carefully designed thermal route where all of the thermal resistances were reduced. For the case-to-heatsink interconnection, this mandated that thermal grease be used to minimalize the interconnection resistance. Fortunately, PCM’s provided an alternate to the messy application and further the migration problems associated with thermal grease. PCM can be bifurcated in the Conductive type (Electrically Conductive and Non-electrically Conductive). Thermal Interconnection Material has key properties such as Low thermal Impedance, High bulk conductivity, and high surface wetting and low thermal contact resistance suited for the mass-production activity. Achieving contact at the interconnection and full surface wetting is critical for maximizing heat transfer and minimizing contact resistance. The flexibility to infiltrate varying degrees of surface roughness is critical. Lower viscosity is linked with higher wetting properties and can be measured by the contact angle. A lower contact angle points towards excellent wetting. While the actual throughput rates are dependent on the equipment capacities, it is not uncommon to be able to produce small parts at a rate of several thousand per hour. In 2019, Asia-Pacific was the chief consumer of PCM components, followed by North America. The inorganic PCM accounts for the largest share among types of PCM owing to the increasing usage in numerous applications due to its high latent heat of fusion, good thermal conductivity, non-flammability, and lower cost.